Production of copper powder form printed circuit boards by electrodeposition
by Masavetas I., Moutsatsou A., Nikolaou E., Spanou S., Zoikis-Karathanasis A., Pavlatou E.A., Spyrellis N.
Papers presented at 2nd International Conference on Engineering for Waste Valorisation - WasteEng2008, 3-5 June 2008, Patras, Greece
by Masavetas I., Moutsatsou A., Nikolaou E., Spanou S., Zoikis-Karathanasis A., Pavlatou E.A., Spyrellis N.
by Murthy Z.V.P., Chaudhari L.B.
by Dhodapkar R., Borde P., Nandy T.
by Shareefdeen Z.
by Chojnacka Katarzyna, Michalak
by Vázquez G., González-Álvarez J., Freire M.S., Calvo M., Antorrena G.
by Petavy F., Ruban V., Conil P., Viau J-Y., Auriol J-C.
by MILLIOLI V.S., SERVULO E.L.C., SOBRAL L.G.S., DE CARVALHO D.D.
by Henon F., Tremier A., Debenest G., Quintard M., Mertel J-L.
by Tsatsarelis T., Karagiannidis A.
by Nugteren H.W., Butselaar-Orthlieb V.C.L., Izquierdo M.
by Provis J.L., Duxson P., Harrex R.M., Yong C-Z., van Deventer J.S.J.
by Zaharaki D., Komnitsas K.
by Giannopoulou I., Dimas D., Maragkos I., Panias D.
by Abeliotis K., Karaiskou K., Togia A., Lasaridi K.